Issued Patents 2020
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10863626 | Electronic package carrier structure thereof, and method for fabricating the carrier structure | Yu-Lung Huang, Chee-Key Chung, Yuan-Hung Hsu | 2020-12-08 |
| 10763223 | Substrate structure having chamfers | Po-Hao Wang, Chun-Tang Lin, Bo-Hao Chang | 2020-09-01 |
| 10763237 | Method for manufacturing electronic package | Yu-Min Lo, Chee-Key Chung, Kuo-Hua Yu, Hsiang-Hua Huang | 2020-09-01 |
| 10756438 | Electronic package and method for fabricating the same | Han-Hung Chen, Chun-Yi Huang, Rung-Jeng Lin, Kuo-Hua Yu | 2020-08-25 |
| 10741500 | Electronic package | Chen-Yu Huang, Chee-Key Chung, Kong-Toon Ng, Rui-Feng Tai, Bo MA | 2020-08-11 |
| 10679932 | Semiconductor package and a substrate for packaging | Ho-Yi Tsai, Chin-Tsai Yao | 2020-06-09 |
| 10600708 | Electronic package and method for fabricating the same | Wen-Shan Tsai, Chee-Key Chung | 2020-03-24 |