Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763241 | Stacked package structure and stacked packaging method for chip | — | 2020-09-01 |
| 10741481 | Integrated package assembly for switching regulator | Jiaming Ye | 2020-08-11 |
| 10734249 | Package structure and method thereof | — | 2020-08-04 |