Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10876000 | Thermosetting resin composition, prepreg, laminated board, printed wiring board, and high speed communication-compatible module | Tomokazu Shimada, Kazutoshi Danjoubara, Tomio Fukuda, Minoru Kakitani | 2020-12-29 |