Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10804675 | To-can package semiconductor laser device having a pinless region on the underside of the package | Masato Hagimoto, Shintaro Miyamoto | 2020-10-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10804675 | To-can package semiconductor laser device having a pinless region on the underside of the package | Masato Hagimoto, Shintaro Miyamoto | 2020-10-13 |