TJ

Tengfei Jiang

University Of Texas System: 1 patents #101 of 675Top 15%
📍 Hangzhou City, FL: #7 of 10 inventorsTop 70%
Overall (2020): #251,049 of 565,922Top 45%
1
Patents 2020

Issued Patents 2020

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10727165 Capped through-silicon-vias for 3D integrated circuits Paul S. Ho 2020-07-28