Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854496 | Circuit substrate processing laminate and method for processing circuit substrate | Shohei Tagami | 2020-12-01 |
| 10796939 | Temporary adhesive film roll for substrate processing, method for manufacturing thin wafer | Masahito Tanabe, Kazunori Kondo, Hiroyuki Yasuda | 2020-10-06 |
| 10727103 | Semiconductor device, method for producing the same, and laminate | Hiroyuki Yasuda | 2020-07-28 |
| 10658314 | Wafer laminate, method for production thereof, and adhesive composition for wafer laminate | Hiroyuki Yasuda, Hideto Kato | 2020-05-19 |
| 10553552 | Wafer laminate and method of producing the same | Hiroyuki Yasuda, Hideto Kato | 2020-02-04 |