Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10780530 | Solder ball, solder joint, and joining method | Hiroki Oshima, Takeo Saitoh, Takahiro Nishizaki, Tomohisa Kawanago, Masato Shiratori | 2020-09-22 |
| 10780531 | Solder ball, solder joint, and joining method | Hiroyoshi Kawasaki, Yuri Nakamura, Osamu Munekata | 2020-09-22 |
| 10722965 | Solder ball supplying method, solder ball supplying device, and solder bump forming method | Takeo Saito, Manabu Muraoka, Hiroki Oshima | 2020-07-28 |
| 10675719 | Joining member, solder material, solder paste, formed solder, flux coated material, and solder joint | Hiroyoshi Kawasaki, Shigeki Kondo, Atsushi Ikeda, Takahiro Roppongi, Takashi Hagiwara +3 more | 2020-06-09 |