Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10665562 | Power electronics assembly having an adhesion layer, and method for producing said assembly | — | 2020-05-26 |
| 10603741 | Apparatus for the material-bonded connection of connection partners of a power-electronics component | Ingo Bogen, Heiko Braml, Christian Göbl, Jürgen Windischmann | 2020-03-31 |