Issued Patents 2020
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861822 | Wafer-level packaging method and package structure thereof | Hailong LUO | 2020-12-08 |
| 10804177 | Wafer-level packaging method and package structure thereof | Hailong LUO | 2020-10-13 |
| 10790211 | Wafer-level packaging method and package structure thereof | Hailong LUO | 2020-09-29 |
| 10784229 | Wafer level package structure and wafer level packaging method | Hailong LUO | 2020-09-22 |
| 10756051 | Wafer-level system packaging method and package structure | Hailong LUO | 2020-08-25 |
| 10700663 | Resonator and related manufacturing method | Herb He Huang, Jiguang Zhu, Haiting Li | 2020-06-30 |
| 10693431 | Manufacturing of thin-film bulk acoustic resonator and semiconductor apparatus comprising the same | Herb He Huang, Jiguang Zhu, Haiting Li | 2020-06-23 |
| 10686422 | Manufacturing of thin-film bulk acoustic resonator and semiconductor apparatus comprising the same | Herb He Huang, Jiguang Zhu, Haiting Li | 2020-06-16 |