YH

Yasutoshi Hideshima

SE Seiko Epson: 2 patents #299 of 1,345Top 25%
Overall (2020): #106,174 of 565,922Top 20%
2
Patents 2020

Issued Patents 2020

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
10682697 Compound for metal powder injection molding, metal powder molded body, method for producing sintered body, and sintered body Hidefumi NAKAMURA 2020-06-16
10675682 Compound for metal powder injection molding, metal powder molded body, method for producing sintered body, and sintered body Hidefumi NAKAMURA 2020-06-09