Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10620377 | Kinematic chip to chip bonding | Todd Bauer, Michael David Henry, Andrew T. S. Pomerene | 2020-04-14 |
| 10570010 | Fabrication of multilayered carbon MEMS devices | Patrick Sean Finnegan, Cody M. Washburn, David R. Wheeler, Timothy N. Lambert, Lee Taylor Massey +2 more | 2020-02-25 |