Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10833044 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2020-11-10 |
| 10717866 | Organic-inorganic hybrid composition, and article and optical component including the same | Yoshiyuki Oishi, Hiroshi Miyao, Yukika Yamada, Ryosuke Kamitani | 2020-07-21 |
| 10593643 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2020-03-17 |
| 10559726 | Layered structures and quantum dot sheets and electronic devices including the same | Hyun A Kang, Nayoun Won, Eun Joo JANG, Ha Il KWON, Jeong Hee Lee +1 more | 2020-02-11 |