Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840159 | Semiconductor chip including chip pad, redistribution wiring test pad, and redistribution wiring connection pad | Hyun-Soo Chung, Chan-Ho Lee | 2020-11-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840159 | Semiconductor chip including chip pad, redistribution wiring test pad, and redistribution wiring connection pad | Hyun-Soo Chung, Chan-Ho Lee | 2020-11-17 |