Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847369 | Wafer bonding method, method for manufacturing semiconductor device, and apparatus therefor | Shinji Ueyama, Fumitaka MOROISHI | 2020-11-24 |
| 10823682 | Water measurement apparatus | Takamasa Sugiura, Fumitaka MOROISHI | 2020-11-03 |