Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10692833 | Apparatus for correcting a parallelism between a bonding head and a stage, and a chip bonder including the same | Jae-cheol KIM, Gil Man Kang, Yong-Dae Ha | 2020-06-23 |