Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10734059 | Semiconductor device having interconnection in package and method for manufacturing the same | Jaehyung Lee, Jungsik Kim, Youngdae Lee, Duyeul Kim, Sungmin Yim +1 more | 2020-08-04 |