Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10825710 | Support substrates, methods of fabricating semiconductor packages using the same, and methods of fabricating electronic devices using the same | Seung Hwan Lee | 2020-11-03 |
| 10665571 | Semiconductor package | — | 2020-05-26 |