Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10529676 | Semiconductor assembly with package on package structure and electronic device including the same | Chul-Woo Park, Kwang Sub Lee, Sang Gyun Lee, Se Young Jang, Chi-Hyun Cho | 2020-01-07 |