Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840175 | Film package, chip-on-film package, and package module | — | 2020-11-17 |
| 10741628 | Printed circuit boards including drive circuits, and related semiconductor devices | Minhwa Jang, Yechung Chung | 2020-08-11 |