Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10714361 | Method of fabricating a semiconductor package using an insulating polymer layer | Sung Dong KIM | 2020-07-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10714361 | Method of fabricating a semiconductor package using an insulating polymer layer | Sung Dong KIM | 2020-07-14 |