Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10679930 | Metal core solder ball interconnector fan-out wafer level package | Hyun Woo Lee, Hyun Joo Kim, Jin Young Ock | 2020-06-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10679930 | Metal core solder ball interconnector fan-out wafer level package | Hyun Woo Lee, Hyun Joo Kim, Jin Young Ock | 2020-06-09 |