Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872802 | Method of debonding a carrier substrate from a device substrate, apparatus for performing the same, and method of singulating semiconductor chips including the same | Myung-Kee Chung | 2020-12-22 |
| 10756062 | Semiconductor chip and semiconductor package including the same | Kyoung Soo Kim, Seung-Duk Baek, Sun-Won Kang, Ho-Geon Song | 2020-08-25 |