Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10734367 | Semiconductor package and method of fabricating the same | Seung-Kwan Ryu, Yonghwan Kwon, Yun-Seok Choi, Taeje Cho | 2020-08-04 |
| 10651224 | Semiconductor package including a redistribution line | Ji Hwang Kim, Hyoeun Kim, Jongbo Shim, Sang-Uk Han | 2020-05-12 |