Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10877217 | Copackaging of asic and silicon photonics | Gerald Cois Byrd, David Arlo Nelson, Javid Messian, Thomas Pierre Schrans, Chia-Te Chou | 2020-12-29 |
| 10872854 | Electro-optical package and method of fabrication | Vivek Raghunathan, Vivek Raghuraman | 2020-12-22 |
| 10761262 | Module with transmit and receive optical subassemblies with specific pic cooling architecture | Gerald Cois Byrd, Chia-Te Chou | 2020-09-01 |