Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872837 | Air-cavity semiconductor package with low cost high thermal carrier | Christine Blair | 2020-12-22 |
| 10855240 | Structures for spatial power-combining devices | Christo Bojkov, Dylan Murdock | 2020-12-01 |
| 10832984 | Environmental protection for wafer level and package level applications | Christo Bojkov, Andrew Arthur Ketterson | 2020-11-10 |
| 10734301 | Semiconductor package with floating heat spreader and process for making the same | — | 2020-08-04 |
| 10651103 | Environmental protection for wafer level and package level applications | Christo Bojkov, Andrew Arthur Ketterson | 2020-05-12 |