Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879141 | Insulated heat dissipation substrate | Takashi Ebigase | 2020-12-29 |
| 10861769 | Insulated heat dissipation substrate | Takashi Ebigase | 2020-12-08 |
| 10763240 | Semiconductor device comprising signal terminals extending from encapsulant | Kaisei Satou, Yuri Imai | 2020-09-01 |
| 10546760 | Method of manufacturing semiconductor device | Takuya Kadoguchi, Yuuji Hanaki, Atsuko YAMANAKA, Shou Funano, Satoshi Takahagi | 2020-01-28 |