Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10679920 | Semiconductor device having semiconductor package in a wiring board opening | Hideki Niimi | 2020-06-09 |
| 10629792 | Wiring substrate and production method thereof | — | 2020-04-21 |