Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10668697 | Method for manufacturing metal clad laminated board, method for manufacturing electronic circuit board, and rigid body pendulum type viscoelasticity measuring device | Masaya Koyama, Hiroaki Takahashi, Yoshinori Matsuzaki, Tadashi Mori | 2020-06-02 |
| 10568201 | Multilayer printed wiring board and multilayer metal clad laminated board | Hiroaki Takahashi, Tomoyuki Aoki, Jun Tochihira, Ryu Harada | 2020-02-18 |