Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840106 | Planarization and flip-chip fabrication process of fine-line-geometry features with high-roughness metal-alloyed surfaces | JAMES PAO, Majid Riaziat, Ta-Chung Wu | 2020-11-17 |