Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10537019 | Substrate dielectric crack prevention using interleaved metal plane | Tingdong Zhou, Twila J. Eichman, James S. Golab, Chee Seng Foong | 2020-01-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10537019 | Substrate dielectric crack prevention using interleaved metal plane | Tingdong Zhou, Twila J. Eichman, James S. Golab, Chee Seng Foong | 2020-01-14 |