Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10825789 | Underbump metallization dimension variation with improved reliability | Leo van Gemert, Adrianus Buijsman, Jeroen Johannes Maria Zaal, Michiel van Soestbergen | 2020-11-03 |
| 10613136 | Apparatus comprising a semiconductor arrangement | Leo van Gemert | 2020-04-07 |