Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10825789 | Underbump metallization dimension variation with improved reliability | Adrianus Buijsman, Jeroen Johannes Maria Zaal, Michiel van Soestbergen, Peter Joseph Hubert Drummen | 2020-11-03 |
| 10613136 | Apparatus comprising a semiconductor arrangement | Peter Joseph Hubert Drummen | 2020-04-07 |
| 10615134 | Integrated circuit package | Maristella Spella, Waqas Hassan Syed, Daniele Cavallo, Mingda Huang | 2020-04-07 |