Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879084 | Molded package | Yun Liu, Yuhua Lee, Chengsheng Ku, Chingming Liu, Mengming Zhu +1 more | 2020-12-29 |
| 10629456 | Molded package and method of manufacture | Yun Liu, Yuhua Lee, Chengsheng Ku, Chingming Liu, Mengming Zhu +1 more | 2020-04-21 |