Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10714436 | Systems and methods for achieving uniformity across a redistribution layer | Bryan L. Buckalew, Steven T. Mayer, Stephen J. Banik, II, Justin Oberst | 2020-07-14 |
| 10662545 | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating | Steven T. Mayer, Bryan L. Buckalew, Haiying Fu, Hilton Diaz Camilo, Robert Rash +1 more | 2020-05-26 |
| 10648097 | Copper electrodeposition on cobalt lined features | Jeyavel Velmurugan, Bryan L. Buckalew | 2020-05-12 |
| 10538855 | Cleaning electroplating substrate holders using reverse current deplating | Lee Peng Chua, Steven T. Mayer, Santosh Kumar | 2020-01-21 |