Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10821543 | Joint manufacturing method | Nao Kamakura, Satoshi Honda | 2020-11-03 |
| 10756060 | Semiconductor device | Yuki Uchida, Takeshi Watanabe, Ken Hayakawa, Ayana Amano, Reishuku Ikebe | 2020-08-25 |
| 10748866 | Thermal bonding sheet, thermal bonding sheet with dicing tape, bonded body production method, and power semiconductor device | Nao Kamakura, Satoshi Honda | 2020-08-18 |
| 10707184 | Thermal bonding sheet and thermal bonding sheet with dicing tape | Nao Kamakura | 2020-07-07 |
| 10685933 | Thermal bonding sheet and thermal bonding sheet with dicing tape | Nao Kamakura | 2020-06-16 |
| 10669452 | Thermal bonding sheet and thermal bonding sheet with dicing tape | Nao Kamakura | 2020-06-02 |