Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763820 | Methods of manufacturing electronic devices formed in a cavity and including a via | — | 2020-09-01 |
| 10574202 | Electronic package including cavity formed by removal of sacrificial material from within a cap | Mitsuhiro Furukawa, Ichiro Kameyama, Tetsuya Uebayashi | 2020-02-25 |