Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10804073 | Apparatus and method for large-scale high throughput quantitative characterization and three-dimensional reconstruction of material structure | Haizhou Wang, Xing Yu, Xuejing Shen, Yunhai Jia, Xiaojia Li +4 more | 2020-10-13 |