Issued Patents 2020
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10825794 | Method for preparing a semiconductor apparatus | Chin-Lung Chu | 2020-11-03 |
| 10811545 | Sensing module and image capturing apparatus | Chiung-Han Wang, Wen-Chen Lee, Jen-Chieh Wu | 2020-10-20 |
| 10607858 | Semiconductor method for forming semiconductor structure having bump on tilting upper corner surface | Chin-Lung Chu | 2020-03-31 |
| 10580665 | Method for manufacturing package structure having elastic bump | — | 2020-03-03 |
| 10566294 | Semiconductor structure | Chin-Lung Chu | 2020-02-18 |
| 10552862 | Interruption point determination | Jacqueline Cheng, Chao Yuan Huang, Yen Lin Li, Lin Chung Liang | 2020-02-04 |
| 10535621 | Method for preparing a semiconductor package | — | 2020-01-14 |