Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10788531 | Reduced cost package device simulator, manufacturing method and method of use | Bruce Rogers, Jack Lewis, Tim Conner, Jay J. Williams, Mike Young +1 more | 2020-09-29 |
| D893433 | Electrical interconnect capsule | Jack Lewis | 2020-08-18 |
| 10705120 | Force deflection and resistance testing system and method of use | Jack Lewis | 2020-07-07 |
| 10534017 | Quick change small footprint testing system and method of use | Jack Lewis | 2020-01-14 |