Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840180 | Production method for multilayer wiring board | Takenori Yanai, Toshimi Nakamura | 2020-11-17 |
| 10772219 | Copper foil with carrier, copper foil with resin and method for manufacturing printed wiring board | — | 2020-09-08 |
| 10763002 | Surface-treated copper foil, manufacturing method therefor, printed circuit board copper-clad laminate, and printed circuit board | — | 2020-09-01 |
| 10645809 | Surface-treated copper foil, method for producing same, copper-clad laminate for printed wiring board, and printed wiring board | Joe Nishikawa, Hiroaki Kurihara | 2020-05-05 |