Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10808103 | Resin composition, laminate including the resin composition, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device including the semiconductor wafer with resin composition layer | Kohei Higashiguchi, Tsuyoshi Kida | 2020-10-20 |