| 10847367 |
Methods of forming tungsten structures |
David Ross Economy, Brian Beatty, Yongjun Jeff Hu, Jordan D. Greenlee |
2020-11-24 |
| 10840255 |
Methods of filling openings with conductive material, and assemblies having vertically-stacked conductive structures |
Jordan D. Greenlee, Everett A. McTeer |
2020-11-17 |
| 10777651 |
Gate stacks |
Yushi Hu, Eric Blomiley, Everett A. McTeer, Matthew J. King |
2020-09-15 |
| 10731273 |
Source material for electronic device applications |
Yushi Hu, Yongjun Jeff Hu, Everett A. McTeer |
2020-08-04 |
| 10727250 |
Methods used in forming an array of elevationally-extending transistors |
Jordan D. Greenlee, E. Allen McTeer |
2020-07-28 |
| 10700091 |
Assemblies having vertically-extending structures, and methods of forming assemblies having vertically-extending channel material pillars |
David Ross Economy, Haoyu Li, Yongjun Jeff Hu, Christopher W. Petz, Daniel Billingsley +1 more |
2020-06-30 |
| 10651381 |
Apparatuses including electrodes having a conductive barrier material and methods of forming same |
Swapnil Lengade, Andrea Gotti |
2020-05-12 |
| 10573661 |
Methods of filling horizontally-extending openings of integrated assemblies |
Jordan D. Greenlee, Chet E. Carter, Collin Howder, Everett A. McTeer |
2020-02-25 |
| 10559579 |
Assemblies having vertically-stacked conductive structures |
Jordan D. Greenlee, Everett A. McTeer |
2020-02-11 |
| 10553611 |
Memory arrays and methods of fabricating integrated structure |
Yushi Hu, Rita J. Klein, John D. Hopkins, Hongbin Zhu, Gordon A. Haller +1 more |
2020-02-04 |
| 10546848 |
Integrated assemblies and methods of forming integrated assemblies |
Daniel Billingsley, Everett A. McTeer, Christopher W. Petz, Haoyu Li, Yongjun Jeff Hu |
2020-01-28 |
