Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10788512 | Cantilever microprobes for contacting electronic components | Richard T. Chen, Ezekiel J. J. Kruglick, Christopher A. Bang, Pavel B. Lembrikov | 2020-09-29 |
| 10676836 | Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates | Adam L. Cohen, Michael S. Lockard, Kieun Kim, Qui T. Le, Gang Zhang +2 more | 2020-06-09 |
| 10641792 | Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties | Ming Ting Wu, Rulon J. Larsen, III, Young Kim, Kieun Kim, Adam L. Cohen +2 more | 2020-05-05 |