Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10815389 | Photosensitive and via-forming circuit board | — | 2020-10-27 |
| 10743418 | Thinned flexible polyimide substrate and method for manufacturing the same | — | 2020-08-11 |
| 10584209 | Photosensitive polyimide resin composition and method of manufacturing cover film using the same | Kunhan Hsieh | 2020-03-10 |
| 10538626 | Polyimide resin, thin film and method for manufacturing thereof | Bo-Hung Lai, Wei-Ming Hou | 2020-01-21 |