Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763130 | Systems and methods for improved delamination characteristics in a semiconductor package | Taweesak Laevohan, Jaggrit Vilairat, Sutee Thanaisawn, Janpen Phimphuang, Somsak Chunpangam | 2020-09-01 |