Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847488 | Semiconductor package having multi-tier bonding wires and components directly mounted on the multi-tier bonding wires | — | 2020-11-24 |
| 10685943 | Semiconductor chip package with resilient conductive paste post and fabrication method thereof | Hsueh-Te Wang | 2020-06-16 |