Issued Patents 2020
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879443 | LED package structure, chip carrier, and method for manufacturing chip carrier | Yu-Yu Chang | 2020-12-29 |
| 10777723 | LED package structure, heat-dissipating substrate, method for manufacturing LED package structure, and method for manufacturing heat-dissipating substrate | — | 2020-09-15 |
| 10727383 | LED package structure | Yu-Yu Chang, Shih-Chiang Yen, Yi-Hsuan Chen | 2020-07-28 |
| 10690538 | Optical sensor module and a wearable device including the same | — | 2020-06-23 |
| 10686096 | Optical sensor module and a wearable device including the same | Tsan-Yu Ho, Meng-Sung Chou | 2020-06-16 |
| 10658556 | LED package structure and multilayer circuit board | Tsung-Kang Ying, Pin-Feng Hung | 2020-05-19 |
| 10655828 | LED package structure | Ming-Kun Weng | 2020-05-19 |
| 10573797 | LED packages structure, heat-dissipating substrate, and method for manufacturing heat-dissipating substrate | — | 2020-02-25 |