Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10814374 | Cooling apparatus for a hot stamping die | Sung Yong Park, Won IK EOM, Sung Ho Yun, Jun-Ho Kwon | 2020-10-27 |
| 10807408 | Decoration member and manufacturing method therefor | Jeong Woo Shon, Song Ho Jang, Jin Suk Song, Ji Young Hwang, Ki Hwan Kim +2 more | 2020-10-20 |
| 10680762 | Modem chip for performing hybrid automatic repeat request processing, application processor including the modem chip, and operating method of the modem chip | Hyun-Sang Cho, Hyun-young Oh, In Chul Song | 2020-06-09 |
| 10654248 | Conductive structure and electronic device comprising same | Sujin Kim, Ki Hwan Kim | 2020-05-19 |
| 10647089 | Conductive structure and electronic device comprising same | Sujin Kim, Pumsuk Park, Ki Hwan Kim | 2020-05-12 |
| 10576485 | Ejector having a curved guide to improve flow efficiency and cooling apparatus having the same | Hee-moon Jeong, Yong Taek HONG, Seok Uk Kim, Seong Ho Kil, Bo-heum Kim +2 more | 2020-03-03 |