Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10859598 | Back-drilled via attachment technique using a UV-cure conductive adhesive | Karl A. Rinder, Daniel G. Knierim | 2020-12-08 |
| 10845384 | Surface-mountable apparatus for coupling a test and measurement instrument to a device under test | — | 2020-11-24 |
| 10739381 | Component attachment technique using a UV-cure conductive adhesive | Regina R. Mrozik | 2020-08-11 |