Issued Patents 2020
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10741519 | Systems of applying materials to components | Michael S. Wladyka, Keith David Johnson, Jingting Yang, Kevin Joel Bohrer, Mark D. Kittel | 2020-08-11 |
| 10741471 | Highly compliant non-silicone putties and thermal interface materials including the same | Eugene Anthony Pruss | 2020-08-11 |
| 10687447 | Methods of applying thermal interface materials to board level shields | Sri Talpallikar | 2020-06-16 |
| D881822 | Material having an edge shape | Michael S. Wladyka, Keith David Johnson, Mark D. Kittel, Jingting Yang | 2020-04-21 |
| D879046 | Material having edging | Michael S. Wladyka, Keith David Johnson, Mark D. Kittel, Jingting Yang | 2020-03-24 |
| 10600714 | Methods for establishing thermal joints between heat spreaders or lids and heat sources | Richard F. Hill | 2020-03-24 |
| 10555439 | Thermal interface materials with reinforcement for abrasion resistance and/or suitable for use between sliding components | Keith David Johnson, Douglas S. McBain, Eugene Anthony Pruss | 2020-02-04 |